BGA Soldering Balls - 0.65mm
Features:
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Ball size: 0.65mm
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Quantity: 25K pcs/bottle
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Ball alloy: Sn63/Pb37 - SGS Tested and Certified
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It is widely used in notebook, mobile phone and other electronics BGA reballing.
Packing:
Original package + carton box
After-sale service:
Please feel free to contact us for any problems at any time:support@rewatechnology.com