Multifunctional PCB Holder for iPhone X
This item includes:
CPU fast positioning welding piece
Net of square hole laser main board
Protect Main board slice
Hard disk square hole laser stannum
Heat conduction glue
Height: 9 mm
Size: 15*9.8*0.9 cm
Quality grade: OEM NEW
For iPhone X
The first fixture uses heat conduction of pure copper for avoiding tin-burst on the back IC of cell phone motherboard, apply heat conduction sticker on the back of the IC on motherboard to prevent metal directly touching IC and cause IC damage, pure copper heat conduction block does not directly contact the main board
The IPhone X PCB fixture added A11 CPU / LGA80 NAND positioning structure. No manual positioning needed, improve the success rate.
The IPhone X PCB Test fixture with integrated layer tin planting function. The precision stencils are produced by world's leading laser technology.
IPhone x PCB holder fixture added motherboard layer separation and positioning installation structure.
Anti-static bag + air bubble envelope + foam box + carton box
After Sales Service:
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